{"id":1300,"date":"2025-07-09T15:15:34","date_gmt":"2025-07-09T06:15:34","guid":{"rendered":"http:\/\/hoyutech.co.jp\/wordpress\/?page_id=1300"},"modified":"2025-09-18T14:04:46","modified_gmt":"2025-09-18T05:04:46","slug":"history","status":"publish","type":"page","link":"http:\/\/hoyutech.co.jp\/en\/company\/history\/","title":{"rendered":"Company History"},"content":{"rendered":"\r\n
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The History of HOYU Tech
\u2014Supporting Japan
and the World<\/h2>\r\n\r\n\r\n\r\n

Since its founding, HOYU Tech has continuously taken on challenges and accomplished great achievements in order to provide solutions for its customers. Here, we introduce the history of the HOYU Group.<\/p>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div>\r\n<\/div><\/div>\r\n\r\n\r\n\r\n

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1999<\/strong>Heisei 11(1999)<\/dt>\r\n
October<\/strong>
Established a 3D CAD Development Research Lab on the Tsinghua University Campus
(Beijing Fangyuan Research Institute, China)<\/dd>\r\n<\/dl>\r\n<\/section>\r\n
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2001<\/strong>Heisei 13(2001)<\/dt>\r\n
October<\/strong>
Established Beijing HOYU Technology Development Co., Ltd.
(formerly Beijing Fangyuan Research Institute, China)<\/dd>\r\n
2002<\/strong>Heisei 14(2002)<\/dt>\r\n
October<\/strong>
Developed “FoldUp3D!”\u2014a Plug-In Software for Packaging Design<\/dd>\r\n
2003<\/strong>Heisei 15(2003)<\/dt>\r\n
June<\/strong>
Developed and Released the Chinese Version of “Box-Vellum,”
a Software for the Packaging Industry<\/dd>\r\n
2004<\/strong>Heisei 16(2004)<\/dt>\r\n
September<\/strong>
Started Receiving Orders for Core Systems for the Japanese Market<\/dd>\r\n
2006<\/strong>Heisei 18(2006)<\/dt>\r\n
April<\/strong>
Conducted Internal Training on CMM3<\/dd>\r\n
2007<\/strong>Heisei 19(2007)<\/dt>\r\n
May<\/strong>
Started Initiatives for Automotive System Development

October<\/strong>
Implemented CATIA+DB Development<\/dd>\r\n
2008<\/strong>Heisei 20(2008)<\/dt>\r\n
April<\/strong>
Began development of image processing for in-vehicle products

May<\/strong>
Started a consulting project in collaboration with a Chinese university<\/dd>\r\n
2009<\/strong>Heisei 21(2009)<\/dt>\r\n
April<\/strong>
Conducted market research operations in China

September<\/strong>
Initiated overseas development of embedded vehicle systems<\/dd>\r\n<\/dl>\r\n<\/section>\r\n
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2010<\/strong>Heisei 22(2010)<\/dt>\r\n
August<\/strong>
Provided consulting services for partnerships between Japanese auto parts \r\nmanufacturers and Chinese automakers<\/dd>\r\n
2012<\/strong>Heisei 24(2012)<\/dt>\r\n
January<\/strong>
Started outsourced development of prototype in-vehicle products for the Chinese market
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September<\/strong>
Established Hoyo Tech Co., Ltd.
(Spun off the former software division from Comnet Co., Ltd.)
and in the same month, Beijing Hoyo Technology Development Co., Ltd. became a subsidiary<\/dd>\r\n
2013<\/strong>Heisei 25(2013)<\/dt>\r\n
August<\/strong>
Started outsourced development of small-scale in-vehicle communication systems \r\nfor the Chinese market<\/dd>\r\n
2014<\/strong>Heisei 26(2014)<\/dt>\r\n
January<\/strong>
Nagoya Development Center commenced operations
(Started contracted upstream development for in-vehicle embedded systems)

March<\/strong>
Established Hoyo Assist Co., Ltd.<\/dd>\r\n
2015<\/strong>Heisei 27(2015)<\/dt>\r\n
October<\/strong>
Participated in a development project with Aisin Advics
(Changzhou) Management Co., Ltd. (Advics Changzhou)
and a Chinese automobile manufacturer<\/dd>\r\n
2016<\/strong>Heisei 28(2016)<\/dt>\r\n
October<\/strong>
Participated in a development project with Aisin AW Co., Ltd.<\/dd>\r\n
2017<\/strong>Heisei 29(2017)<\/dt>\r\n
June<\/strong>
Merged Hoyo Assist Co., Ltd. and increased capital to 10 million yen

September<\/strong>
articipated in a development project with Aisin Seiki Co., Ltd.<\/dd>\r\n
2018<\/strong>Heisei 30(2018)<\/dt>\r\n
September<\/strong>
Participated in a development project with Aisin (Nantong)
Automotive Technology Center Co., Ltd. and a Chinese automobile manufacturer<\/dd>\r\n<\/dl>\r\n<\/section>\r\n
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2022<\/strong>Reiwa4(2022)<\/dt>\r\n
November<\/strong>
Increased capital to 30 million yen<\/dd>\r\n
2023<\/strong>Reiwa5(2023)<\/dt>\r\n
June<\/strong>
Established Changzhou Hoyo Automotive Design Co., Ltd.<\/dd>\r\n<\/dl>\r\n<\/section>\r\n<\/div>\r\n
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Index<\/h3>\r\n