The History of HOYU Tech
—Supporting Japan
and the World
Since its founding, HOYU Tech has continuously taken on challenges and accomplished great achievements in order to provide solutions for its customers. Here, we introduce the history of the HOYU Group.
- 1999Heisei 11(1999)
- October
Established a 3D CAD Development Research Lab on the Tsinghua University Campus
(Beijing Fangyuan Research Institute, China)
- 2001Heisei 13(2001)
- October
Established Beijing HOYU Technology Development Co., Ltd.
(formerly Beijing Fangyuan Research Institute, China) - 2002Heisei 14(2002)
- October
Developed “FoldUp3D!”—a Plug-In Software for Packaging Design - 2003Heisei 15(2003)
- June
Developed and Released the Chinese Version of “Box-Vellum,”
a Software for the Packaging Industry - 2004Heisei 16(2004)
- September
Started Receiving Orders for Core Systems for the Japanese Market - 2006Heisei 18(2006)
- April
Conducted Internal Training on CMM3 - 2007Heisei 19(2007)
- May
Started Initiatives for Automotive System Development
October
Implemented CATIA+DB Development - 2008Heisei 20(2008)
- April
Began development of image processing for in-vehicle products
May
Started a consulting project in collaboration with a Chinese university - 2009Heisei 21(2009)
- April
Conducted market research operations in China
September
Initiated overseas development of embedded vehicle systems
- 2010Heisei 22(2010)
- August
Provided consulting services for partnerships between Japanese auto parts manufacturers and Chinese automakers - 2012Heisei 24(2012)
- January
Started outsourced development of prototype in-vehicle products for the Chinese market
September
Established Hoyo Tech Co., Ltd.
(Spun off the former software division from Comnet Co., Ltd.)
and in the same month, Beijing Hoyo Technology Development Co., Ltd. became a subsidiary - 2013Heisei 25(2013)
- August
Started outsourced development of small-scale in-vehicle communication systems for the Chinese market - 2014Heisei 26(2014)
- January
Nagoya Development Center commenced operations
(Started contracted upstream development for in-vehicle embedded systems)
March
Established Hoyo Assist Co., Ltd. - 2015Heisei 27(2015)
- October
Participated in a development project with Aisin Advics
(Changzhou) Management Co., Ltd. (Advics Changzhou)
and a Chinese automobile manufacturer - 2016Heisei 28(2016)
- October
Participated in a development project with Aisin AW Co., Ltd. - 2017Heisei 29(2017)
- June
Merged Hoyo Assist Co., Ltd. and increased capital to 10 million yen
September
articipated in a development project with Aisin Seiki Co., Ltd. - 2018Heisei 30(2018)
- September
Participated in a development project with Aisin (Nantong)
Automotive Technology Center Co., Ltd. and a Chinese automobile manufacturer
- 2022Reiwa4(2022)
- November
Increased capital to 30 million yen - 2023Reiwa5(2023)
- June
Established Changzhou Hoyo Automotive Design Co., Ltd.
